1、适用范围：硅片、电子精密零件等。
2、适用清洗剂：水剂
3、结构特点：
•各槽上下抛动，工件在抛动过程中使污垢彻底脱落。
•槽体正面设有控制面板，可根据清洗工艺设置。
•每个槽子底部设有接渣口，便以排渣且能及时沉淀污垢。
•使用全水基溶剂环保清洗工艺。

⑴超声清洗（加热）→⑵超声清洗（加热）→⑶超声清洗（加热）→
⑷超声清洗（加热）→⑸超声漂洗（加热）→⑹超声漂洗（加热）
4、技术参数：具体结构尺寸和规格请咨询本公司索要相应清洗工艺。

silicon ultrasonic description

a scope of application: silicon wafers, electronic precision parts and so on.

2, suitable cleaning agent: agent

3, structural features:

• the tank moving up and down throwing the workpiece in the moving process, to throw dirt off completely.

• tank e with front control panel can be set up under the cleaning process.

• each slot has access residue at the bottom of the mouth and can be timely in order to slag deposition dirt.

• make use of environmentally friendly water-based solvent cleaning processes.

⑴ ultrasonic cleaning (heating) → ⑵ ultrasonic cleaning (heating) → ⑶ ultrasonic cleaning (heating) →

⑷ ultrasonic cleaning (heating) → ⑸ ultrasonic rinsing (heating) → ⑹ ultrasonic rinsing (heating)

4, technical parameters: specific structural dimensions and specifications please contact the company ask for the appropriate cleaning technique.